1-1814655-3 original stock_Cheapest 1-1814655-3_TE Connectivity AMP Connectors agent channel source

Sockets for ICs Transistors

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Specifications

Description	Details
Series	-
Package	Bulk
Type	SIP
Number of Positions or Pins (Grid)	20 (1 x 20)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	29.5µin (0.75µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	29.5µin (0.75µm)
Contact Material - Post	Brass
Housing Material	Thermoplastic, Polyester
Operating Temperature	-55°C ~ 125°C

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Price advantage, 1-1814655-3 is available in stock and can be delivered on the same day

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