514-AG12D original stock_Cheapest 514-AG12D_TE Connectivity AMP Connectors agent channel source

Sockets for ICs Transistors

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Specifications

Description	Details
Series	500
Package	Bulk
Type	DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)	14 (2 x 7)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Tin-Lead
Contact Finish Thickness - Mating	-
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Tin-Lead
Contact Finish Thickness - Post	-
Contact Material - Post	Brass, Copper
Housing Material	Polyester
Operating Temperature	-55°C ~ 105°C

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Price advantage, 514-AG12D is available in stock and can be delivered on the same day

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