28-516-10 original stock_Cheapest 28-516-10_Aries Electronics agent channel source

Sockets for ICs Transistors

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Specifications

Description	Details
Series	516
Package	Bulk
Type	DIP, ZIF (ZIP)
Number of Positions or Pins (Grid)	28 (2 x 14)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Tin
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Tin
Contact Finish Thickness - Post	10.0µin (0.25µm)
Contact Material - Post	Beryllium Copper
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature	-

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Price advantage, 28-516-10 is available in stock and can be delivered on the same day

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