522-AG11D original stock_Cheapest 522-AG11D_TE Connectivity AMP Connectors agent channel source

Sockets for ICs Transistors

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Specifications

Description	Details
Series	500
Package	Bulk
Type	DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid)	22 (2 x 11)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	25.0µin (0.63µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Tin-Lead
Contact Finish Thickness - Post	25.0µin (0.63µm)
Contact Material - Post	Brass, Copper
Housing Material	Polyester
Operating Temperature	-55°C ~ 125°C

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Price advantage, 522-AG11D is available in stock and can be delivered on the same day

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